HPE ProLiant Compute XD685
An AMD EPYC platform for AI service providers, large enterprises, and sovereign AI deployments. Chassis height depends on the air or direct liquid cooling configuration.
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Facts
Source per value- Maker The OEM, ODM or system builder that sells the server model. Corporate names follow the vendor’s own pages.
- HPE 1
- GPU vendor Maker of the accelerators named in the GPU model field: NVIDIA, AMD or Intel. Blank when the vendor page names no accelerator.
- NVIDIA 1
- GPU or accelerator Accelerators the vendor page names for this model. A model that supports several options lists the option that was read, marked as one supported option.
- NVIDIA B300 (direct-liquid-cooled option) 1
- GPUs per server GPUs Installed count or supported maximum per server, as the qualifier in the source says. Rack-scale systems show the GPUs in the whole rack (72 for an NVL72). Blank when the page gives no count.
- 8 1
- Chassis height U Rack height of the server as the vendor states it. Open Rack Units (OU) are not the same as EIA U and sit in the form factor field instead.
- Not published
- Form factor Configuration-specific chassis or rack description where the vendor splits it by cooling or rack standard.
- 5U direct liquid cooling; 6U air cooling 1
- Cooling type Air, liquid, or air or liquid by configuration, read from the vendor’s cooling statement. Blank when the page does not state cooling.
- Air or liquid 1
- Cooling (vendor wording) The vendor’s cooling statement with configuration qualifiers kept.
- Air or direct liquid cooling 1
- CPU support Processor families or installed processors the named model supports.
- 5th Generation AMD EPYC 1
- CPU sockets sockets Processors per server.
- Not published
- CPUs per rack CPUs Total CPUs in a rack-scale configuration.
- Not published
- Memory per GPU GB Memory on each accelerator in the cited configuration.
- Not published
- Total GPU memory GB Vendor-stated total accelerator memory per system.
- Not published
- Max system memory TB Vendor-stated maximum host RAM, not GPU memory.
- Not published
- Memory slots DIMMs Host memory DIMM slots.
- Not published
- GPU TDP W Thermal design power per GPU, not measured server draw.
- Not published
- System power kW Maximum power the vendor states for one system, as printed on its own page.
- Not published
- Rack power kW Power the vendor states for a full rack-scale system.
- Not published
- Power supplies PSU ratings, quantity and redundancy where published. Rating, not draw.
- Not published
- Rack power delivery Power-shelf rating in rack-scale and rack-sled systems. Delivery capacity, not rack demand.
- Not published
- GPU interconnect GPU fabric and published link bandwidth.
- Not published
- Networking Published ports, adapters and speeds.
- Not published
- Source date Publication date printed on the cited page, where the vendor prints one.
- Not published
- Warranty Base warranty or service statement the vendor publishes.
- Not published
- Operating temperature °C Supported ambient range with the vendor’s caveats.
- Not published
- Maker headquarters Headquarters or principal corporate office of the maker, not a factory location.
- Spring, United States 2
Sources
- www.hpe.com accessed 2026-11-11
- www.hpe.com accessed 2026-11-11
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