Lenovo ThinkSystem SR680a V4
Lenovo's 8U air-cooled server with eight HGX B300 GPUs and two Xeon 6700 processors. Built for enterprise AI training and inference.
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Facts
Source per value- Maker The OEM, ODM or system builder that sells the server model. Corporate names follow the vendor’s own pages.
- Lenovo 1
- GPU vendor Maker of the accelerators named in the GPU model field: NVIDIA, AMD or Intel. Blank when the vendor page names no accelerator.
- NVIDIA 1
- GPU or accelerator Accelerators the vendor page names for this model. A model that supports several options lists the option that was read, marked as one supported option.
- NVIDIA HGX B300 1
- GPUs per server GPUs Installed count or supported maximum per server, as the qualifier in the source says. Rack-scale systems show the GPUs in the whole rack (72 for an NVL72). Blank when the page gives no count.
- 8 1
- Chassis height U Rack height of the server as the vendor states it. Open Rack Units (OU) are not the same as EIA U and sit in the form factor field instead.
- 8 1
- Form factor Configuration-specific chassis or rack description where the vendor splits it by cooling or rack standard.
- Not published
- Cooling type Air, liquid, or air or liquid by configuration, read from the vendor’s cooling statement. Blank when the page does not state cooling.
- Air 1
- Cooling (vendor wording) The vendor’s cooling statement with configuration qualifiers kept.
- Air-cooled, front-to-rear airflow; 6 × front 60 mm and 15 × rear 80 mm dual-rotor fans, N+1 1
- CPU support Processor families or installed processors the named model supports.
- 2 × Intel Xeon 6700-series (P-core) 1
- CPU sockets sockets Processors per server.
- 2 1
- CPUs per rack CPUs Total CPUs in a rack-scale configuration.
- Not published
- Memory per GPU GB Memory on each accelerator in the cited configuration.
- 288 1
- Total GPU memory GB Vendor-stated total accelerator memory per system.
- 2,300 1
- Max system memory TB Vendor-stated maximum host RAM, not GPU memory.
- 4 1
- Memory slots DIMMs Host memory DIMM slots.
- 32 1
- GPU TDP W Thermal design power per GPU, not measured server draw.
- Not published
- System power kW Maximum power the vendor states for one system, as printed on its own page.
- Not published
- Rack power kW Power the vendor states for a full rack-scale system.
- Not published
- Power supplies PSU ratings, quantity and redundancy where published. Rating, not draw.
- 8 × CRPS Premium 80 PLUS Titanium: 3200 W AC (N+1) or 3800 W HVAC/HVDC (N+1 or N+N) 1
- Rack power delivery Power-shelf rating in rack-scale and rack-sled systems. Delivery capacity, not rack demand.
- Not published
- GPU interconnect GPU fabric and published link bandwidth.
- Not published
- Networking Published ports, adapters and speeds.
- 8 × 800 Gb/s OSFP ConnectX-8 with GPUDirect; 4 × PCIe 5.0 x16 FHHL; 1 × OCP 3.0 1
- Source date Publication date printed on the cited page, where the vendor prints one.
- 2026-10-05 1
- Warranty Base warranty or service statement the vendor publishes.
- Not published
- Operating temperature °C Supported ambient range with the vendor’s caveats.
- Not published
- Maker headquarters Headquarters or principal corporate office of the maker, not a factory location.
- Beijing, China; Morrisville, United States 2
Sources
- lenovopress.lenovo.com accessed 2026-11-11
- investor.lenovo.com accessed 2026-11-11
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