Supermicro SYS-422GS-NBRT-LCC
4U direct-liquid-cooled server with eight NVIDIA HGX B200 GPUs and dual Xeon 6700 CPUs. Sold with full liquid-cooled rack integration for dense AI deployments.
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Facts
Source per value- Maker The OEM, ODM or system builder that sells the server model. Corporate names follow the vendor’s own pages.
- Supermicro 1
- GPU vendor Maker of the accelerators named in the GPU model field: NVIDIA, AMD or Intel. Blank when the vendor page names no accelerator.
- NVIDIA 1
- GPU or accelerator Accelerators the vendor page names for this model. A model that supports several options lists the option that was read, marked as one supported option.
- NVIDIA HGX B200 1
- GPUs per server GPUs Installed count or supported maximum per server, as the qualifier in the source says. Rack-scale systems show the GPUs in the whole rack (72 for an NVL72). Blank when the page gives no count.
- 8 1
- Chassis height U Rack height of the server as the vendor states it. Open Rack Units (OU) are not the same as EIA U and sit in the form factor field instead.
- 4 1
- Form factor Configuration-specific chassis or rack description where the vendor splits it by cooling or rack standard.
- 4U rackmount 1
- Cooling type Air, liquid, or air or liquid by configuration, read from the vendor’s cooling statement. Blank when the page does not state cooling.
- Liquid 1
- Cooling (vendor wording) The vendor’s cooling statement with configuration qualifiers kept.
- Direct-to-chip liquid cold plates, up to 87% heat capture in maximum configuration; 4 × 80 mm fans for remaining air cooling 1
- CPU support Processor families or installed processors the named model supports.
- Dual Intel Xeon 6700-series with P-cores, up to 86 cores each 1
- CPU sockets sockets Processors per server.
- 2 1
- CPUs per rack CPUs Total CPUs in a rack-scale configuration.
- Not published
- Memory per GPU GB Memory on each accelerator in the cited configuration.
- 180 1
- Total GPU memory GB Vendor-stated total accelerator memory per system.
- 1,440 1
- Max system memory TB Vendor-stated maximum host RAM, not GPU memory.
- 4 1
- Memory slots DIMMs Host memory DIMM slots.
- 32 1
- GPU TDP W Thermal design power per GPU, not measured server draw.
- Not published
- System power kW Maximum power the vendor states for one system, as printed on its own page.
- Not published
- Rack power kW Power the vendor states for a full rack-scale system.
- Not published
- Power supplies PSU ratings, quantity and redundancy where published. Rating, not draw.
- 4 × 6600 W Titanium (96%); 2+2 redundancy 1
- Rack power delivery Power-shelf rating in rack-scale and rack-sled systems. Delivery capacity, not rack demand.
- Not published
- GPU interconnect GPU fabric and published link bandwidth.
- NVLink with NVSwitch 1
- Networking Published ports, adapters and speeds.
- 2 × 10GbE RJ45 (Intel X710-AT2), 1 × dedicated BMC/IPMI 1
- Source date Publication date printed on the cited page, where the vendor prints one.
- Not published
- Warranty Base warranty or service statement the vendor publishes.
- Not published
- Operating temperature °C Supported ambient range with the vendor’s caveats.
- 10 to 35 1
- Maker headquarters Headquarters or principal corporate office of the maker, not a factory location.
- San Jose, United States 2
Sources
- www.supermicro.com accessed 2026-11-11
- www.supermicro.com accessed 2026-11-11
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